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Item Details
Title:
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ADVANCED ELECTRONIC PACKAGING
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By: |
Richard K. Ulrich (Editor), William D. Brown (Editor) |
Format: |
Hardback |

List price:
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£164.95 |
Our price: |
£148.46 |
Discount: |
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You save:
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£16.49 |
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ISBN 10: |
0471466093 |
ISBN 13: |
9780471466093 |
Availability: |
Usually dispatched within 1-3 weeks.
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rates
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Stock: |
Currently 0 available |
Publisher: |
JOHN WILEY AND SONS LTD |
Pub. date: |
10 February, 2006 |
Edition: |
2nd Edition |
Series: |
IEEE Press Series on Microelectronic Systems |
Pages: |
840 |
Description: |
This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. |
Synopsis: |
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. |
Publication: |
UK |
Imprint: |
Wiley-Blackwell (an imprint of John Wiley & Sons Ltd) |
Returns: |
Returnable |
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