Title:
|
ADVANCES IN THERMAL MODELLING OF ELECTRONIC COMPONENTS AND SYSTEMS
|
Volume: |
v. 2 |
By: |
American Society of Mechanical Engineers (ASME), Cihan H. Dagli (Editor) |
Format: |
Hardback |
List price:
|
£93.00 |
We currently do not stock this item, please contact the publisher directly for
further information.
|
|
|
|
|
ISBN 10: |
0791800156 |
ISBN 13: |
9780791800157 |
Publisher: |
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
Pub. date: |
1 January, 1990 |
Pages: |
437 |
Synopsis: |
The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories. |
Publication: |
US |
Imprint: |
American Society of Mechanical Engineers,U.S. |
Returns: |
Returnable |