Title:
|
ADVANCES IN THERMAL MODELLING OF ELECTRONIC COMPONENTS AND SYSTEMS
|
Volume: |
v. 3 |
By: |
American Society of Mechanical Engineers (ASME), A.Bar- Cohen (Editor), A.D. Kraus (Editor) |
Format: |
Hardback |

List price:
|
£85.50 |
We currently do not stock this item, please contact the publisher directly for
further information.
|
|
|
|
|
ISBN 10: |
0791800180 |
ISBN 13: |
9780791800188 |
Publisher: |
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
Pages: |
402 |
Synopsis: |
This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers. |
Publication: |
US |
Imprint: |
American Society of Mechanical Engineers,U.S. |
Returns: |
Non-returnable |