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Item Details
| Title:
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MICROELECTRONIC INTERCONNECTIONS AND ASSEMBLY
PROCEEDINGS OF THE NATO ADVANCED RESEARCH WORKSHOP, PRAGUE, CZECH REPUBLIC, 18-21 MAY 1996 |
| By: |
George Harman (Editor), Pavel Mach (Editor) |
| Format: |
Hardback |
| List price:
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£72.00 |
| Our price: |
£61.20 |
| Discount: |
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| You save:
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£10.80 |
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| ISBN 10: |
0792351398 |
| ISBN 13: |
9780792351399 |
| Availability: |
Usually dispatched within 1-3 weeks.
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| Stock: |
Currently 0 available |
| Publisher: |
KLUWER ACADEMIC PUBLISHERS |
| Series: |
NATO Science Partnership Subseries 3: High Technology v. 54 |
| Pages: |
314 |
| Description: |
This text covers the proceedings of the 1996 NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. |
| Synopsis: |
This text covers the proceedings of the NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturization of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers.These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces. |
| Illustrations: |
index |
| Publication: |
US |
| Imprint: |
Kluwer Academic Publishers |
| Returns: |
Returnable |
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