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Item Details
| Title:
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HYBRID ASSEMBLIES AND MULTICHIP MODULES
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| By: |
Fred W. Kear |
| Format: |
Hardback |
| List price:
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£160.00 |
| Our price: |
£144.00 |
| Discount: |
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| You save:
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£16.00 |
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| ISBN 10: |
0824784669 |
| ISBN 13: |
9780824784669 |
| Availability: |
Usually dispatched within 1-3 weeks.
 Delivery
rates
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| Stock: |
Currently 0 available |
| Publisher: |
TAYLOR & FRANCIS INC |
| Pub. date: |
16 December, 1992 |
| Series: |
Manufacturing Engineering and Materials Processing v. 38 |
| Pages: |
296 |
| Description: |
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors. |
| Synopsis: |
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses. |
| Illustrations: |
1, black & white illustrations |
| Publication: |
US |
| Imprint: |
Marcel Dekker Inc |
| Returns: |
Returnable |
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