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Item Details
Title:
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POLYMER SURFACES AND INTERFACES
CHARACTERIZATION, MODIFICATION AND APPLICATION |
By: |
Kash L. Mittal (Editor), K. W. Lee (Editor) |
Format: |
Hardback |

List price:
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£130.00 |
Our price: |
£117.00 |
Discount: |
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You save:
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£13.00 |
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ISBN 10: |
9067642177 |
ISBN 13: |
9789067642170 |
Availability: |
Usually dispatched within 1-3 weeks.
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Stock: |
Currently 0 available |
Publisher: |
TAYLOR & FRANCIS LTD |
Pub. date: |
1 April, 1997 |
Pages: |
424 |
Description: |
This work chronicles the proceedings of the Symposium on Polymer Surfaces and Interfaces: Characterization, Modification and Application, held in Boston, May 7-11, 1995. The articles address many aspects of polymer surfaces and interfaces. |
Synopsis: |
Polymeric materials are used for a legion of applications in a wide array of technological areas, and their proper surface/interface characteristics are of cardinal importance for their applications. Therefore, the need to characterize polymer surfaces/interfaces and their suitable modification to impart desired characteristics is quite patent. This book chronicles the proceedings of the Symposium on Polymer Surfaces and Interfaces: Characterization, Modification and Application held as a part of the Society of Plastics Engineers Annual Technical Conference, Boston, May 7--11, 1995. The articles in this book address many aspects of polymer surfaces and interfaces.Topics covered include: various ways (chemical, photochemical, laser, flame, corona) to modify polymer surfaces; modification of contact lens surfaces; various ways to analyze/characterize polymer surfaces; metal/polymer interfaces; metal/polyimide adhesion; metal/self-assembled organic monolayer interfaces; polymer alignment layers for liquid crystals; alignment of liquid crystal surfaces; polyimide alignment layers; molecular re-orientation of polymer surfaces; plasma polymerized organic coatings; epoxy/fiber interphase; epoxy underfill materials for packaging integrated circuits; transport in polymers; polymer miscibility; and cell adhesion. |
Publication: |
Netherlands |
Imprint: |
VSP International Science Publishers |
Returns: |
Non-returnable |
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