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Item Details
| Title:
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3D MICROELECTRONIC PACKAGING
FROM ARCHITECTURES TO APPLICATIONS |
| Format: |
Hardback |
| List price:
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£139.99 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
9811570892 |
| ISBN 13: |
9789811570896 |
| Publisher: |
SPRINGER VERLAG, SINGAPORE |
| Pub. date: |
24 November, 2020 |
| Edition: |
2nd ed. 2021 |
| Series: |
Springer Series in Advanced Microelectronics |
| Pages: |
622 |
| Description: |
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. |
| Illustrations: |
100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622 p. 299 illus., 205 illus. in color. |
| Returns: |
Returnable |
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