 |
|
|
Item Details
| Title:
|
MICROELECTRONIC PACKAGING
|
| By: |
M. Datta (Editor), Tetsuya Osaka (Editor), J. Walter Schultze (Editor) |
| Format: |
Electronic book text |
| List price:
|
£178.00 |
|
We believe that this item is permanently unavailable, and so we cannot source
it.
|
|
|
|
|
|
| ISBN 10: |
020347368X |
| ISBN 13: |
9780203473689 |
| Publisher: |
TAYLOR & FRANCIS INC |
| Pub. date: |
20 December, 2004 |
| Series: |
New Trends in Electrochemical Technology |
| Pages: |
568 |
| Synopsis: |
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists. |
| Illustrations: |
100 equations; 86 Halftones, black and white; 56 Tables, black and white; |
| Publication: |
US |
| Imprint: |
CRC Press Inc |
| Returns: |
Non-returnable |
|
|
|
 |
Ramadan and Eid al-Fitr
A celebratory, inclusive and educational exploration of Ramadan and Eid al-Fitr for both children that celebrate and children who want to understand and appreciate their peers who do.
|
|
|
|
|
|
|
|
|
|
|