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Item Details
| Title:
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ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
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| By: |
Michael G. Pecht, Rakish Agarwal, F. Patrick McCluskey |
| Format: |
Hardback |
| List price:
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£155.00 |
| Our price: |
£139.50 |
| Discount: |
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| You save:
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£15.50 |
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| ISBN 10: |
0849396255 |
| ISBN 13: |
9780849396250 |
| Availability: |
Usually dispatched within 1-3 weeks.
 Delivery
rates
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| Stock: |
Currently 0 available |
| Publisher: |
TAYLOR & FRANCIS INC |
| Pub. date: |
18 December, 1998 |
| Series: |
Electronic Packaging 4 |
| Pages: |
128 |
| Description: |
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. |
| Synopsis: |
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: * interconnections * printed circuit boards * substrates * encapsulants * dielectrics * die attach materials * electrical contacts * thermal materials * solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging. |
| Illustrations: |
61 black & white tables |
| Publication: |
US |
| Imprint: |
CRC Press Inc |
| Returns: |
Returnable |
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