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Item Details
Title: SUBSTRATE NOISE COUPLING IN MIXED-SIGNAL ASICS
By: Stephane Donnay (Editor), Georges Gielen (Editor)
Format: Hardback

List price: £179.99


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 140207381X
ISBN 13: 9781402073816
Publisher: SPRINGER-VERLAG NEW YORK INC.
Edition: 2003 ed.
Pages: 287
Description: Provides an overview of very recent research results in the field of substrate noise analysis and reduction techniques. This title includes chapters that describe techniques to model and reduce the digital switching noise injected in the substrate.
Synopsis: This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Illustrations: XXXI, 287 p.
Publication: US
Imprint: Springer-Verlag New York Inc.
Returns: Returnable
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ANALOG IC RELIABILITY IN NANOMETER CMOS (HB)
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ANALOG LAYOUT GENERATION FOR PERFORMANCE AND MANUFACTURABILITY (HB)
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AUTOMATED DESIGN OF ANALOG AND HIGH-FREQUENCY CIRCUITS (HB)
AUTOMATED DESIGN OF ANALOG AND HIGH-FREQUENCY CIRCUITS (PB)
COMPUTER-AIDED DESIGN OF ANALOG INTEGRATED CIRCUITS AND SYSTEMS (HB)
DESIGN OF POWER-EFFICIENT HIGHLY DIGITAL ANALOG-TO-DIGITAL CONVERTERS FOR NEXT-GENERATION WIRELESS COMMUNICATION SYSTEMS
DESIGN OF POWER-EFFICIENT HIGHLY DIGITAL ANALOG-TO-DIGITAL CONVERTERS FOR NEXT-GENERATION WIRELESS COMMUNICATION SYSTEMS
ENCYCLOPEDIA OF CIRCUITS AND SYSTEMS
HIGH-LEVEL MODELING AND SYNTHESIS OF ANALOG INTEGRATED SYSTEMS (HB)
HIGH-LEVEL MODELING AND SYNTHESIS OF ANALOG INTEGRATED SYSTEMS (PB)
LOW-POWER DESIGN TECHNIQUES AND CAD TOOLS FOR ANALOG AND RF INTEGRATED CIRCUITS (HB)
LOW-POWER DESIGN TECHNIQUES AND CAD TOOLS FOR ANALOG AND RF INTEGRATED CIRCUITS (PB)
SUBSTRATE NOISE COUPLING IN MIXED-SIGNAL ASICS (PB)
SYMBOLIC ANALYSIS FOR AUTOMATED DESIGN OF ANALOG INTEGRATED CIRCUITS (HB)
SYMBOLIC ANALYSIS FOR AUTOMATED DESIGN OF ANALOG INTEGRATED CIRCUITS (PB)
SYMBOLIC ANALYSIS OF ANALOG CIRCUITS: TECHNIQUES AND APPLICATIONS (HB)
SYMBOLIC ANALYSIS OF ANALOG CIRCUITS: TECHNIQUES AND APPLICATIONS (PB)
SYSTEMATIC DESIGN OF ANALOG IP BLOCKS (HB)
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SYSTEMATIC MODELING AND ANALYSIS OF TELECOM FRONTENDS AND THEIR BUILDING BLOCKS (HB)
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TEMPERATURE- AND SUPPLY VOLTAGE-INDEPENDENT TIME REFERENCES FOR WIRELESS SENSOR NETWORKS (HB)
TEMPERATURE- AND SUPPLY VOLTAGE-INDEPENDENT TIME REFERENCES FOR WIRELESS SENSOR NETWORKS (PB)
TIME-ENCODING VCO-ADCS FOR INTEGRATED SYSTEMS-ON-CHIP
TIME-ENCODING VCO-ADCS FOR INTEGRATED SYSTEMS-ON-CHIP (HB)
VARIATION-AWARE ANALOG STRUCTURAL SYNTHESIS (HB)

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