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Item Details
Title: ELECTRONIC PACKAGING MATERIALS SCIENCE VIII: VOLUME 390
By: Peter Borgesen (Editor), Kenneth A. Jackson (Editor), Robert C. Sundahl (Editor)
Format: Hardback

List price: £21.99


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ISBN 10: 1558992936
ISBN 13: 9781558992931
Publisher: MATERIALS RESEARCH SOCIETY
Pub. date: 26 September, 1995
Series: MRS Proceedings
Pages: 284
Description: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Synopsis: The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Publication: US
Imprint: Materials Research Society
Returns: Returnable
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