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Item Details
Title:
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CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS
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By: |
Thomas M. Moore, Robert G. Mckenna, C. Richard Brundle |
Format: |
Hardback |
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List price:
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£91.00 |
Our price: |
£81.90 |
Discount: |
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You save:
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£9.10 |
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ISBN 10: |
1606501879 |
ISBN 13: |
9781606501870 |
Availability: |
Usually dispatched within 1-3 weeks.
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Stock: |
Currently 0 available |
Publisher: |
MOMENTUM PRESS |
Pub. date: |
1 March, 2010 |
Series: |
Materials Characterization Series |
Pages: |
274 |
Description: |
With a particular emphasis on fabrication quality control, this volume in the "Materials Characterization" series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. |
Synopsis: |
With a particular emphasis on fabrication quality control, this volume in the "Materials Characterization" series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: general overview of IC package reliability testing; characterization for the electrical performance of IC packages; understanding surface characteristics and interfaces for thermal management; and concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more. |
Illustrations: |
Illustrations |
Publication: |
US |
Imprint: |
Momentum Press |
Returns: |
Returnable |
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