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Item Details
Title: HANDBOOK OF WAFER BONDING
By: Peter Ramm (Editor), James Jian-Qiang Lu (Editor), Maaike M. V. Taklo (Editor)
Format: Electronic book text

List price: £144.00


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ISBN 10: 3527644253
ISBN 13: 9783527644254
Publisher: JOHN WILEY AND SONS LTD
Pub. date: 28 November, 2011
Pages: 425
Synopsis: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Publication: UK
Imprint: Wiley-VCH Verlag GmbH
Returns: Non-returnable
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