| Title:
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MODELING OF ADHESIVELY BONDED JOINTS
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| By: |
Lucas F. M. da Silva (Editor), Andreas Ochsner (Editor) |
| Format: |
Paperback |
| List price:
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£109.99 |
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| ISBN 10: |
3642097898 |
| ISBN 13: |
9783642097898 |
| Publisher: |
SPRINGER-VERLAG BERLIN AND HEIDELBERG GMBH & CO. KG |
| Pub. date: |
19 October, 2010 |
| Edition: |
Softcover reprint of hardcover 1st ed. 2008 |
| Pages: |
335 |
| Description: |
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. This book provides the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique. |
| Synopsis: |
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique. |
| Illustrations: |
12 Tables, black and white; X, 335 p. |
| Publication: |
Germany |
| Imprint: |
Springer-Verlag Berlin and Heidelberg GmbH & Co. K |
| Returns: |
Returnable |