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Item Details
Title: CROSSTALK IN MODERN ON-CHIP INTERCONNECTS
A FDTD APPROACH
Volume: 2016
By: B. K. Kaushik, Amalendu Patnaik
Format: Paperback

List price: £49.99


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ISBN 10: 9811007993
ISBN 13: 9789811007996
Publisher: SPRINGER VERLAG, SINGAPORE
Pub. date: 6 April, 2016
Series: SpringerBriefs in Applied Sciences and Technology
Pages: 131
Synopsis: The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
Illustrations: 71 black & white illustrations, 20 black & white tables, 42 colour tables,
Publication: Singapore
Imprint: Springer Verlag, Singapore
Returns: Returnable
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