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Item Details
| Title:
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MODELING AND APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING
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| By: |
YongAn Huang |
| Format: |
Hardback |
| List price:
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£129.99 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
9811336261 |
| ISBN 13: |
9789811336263 |
| Publisher: |
SPRINGER VERLAG, SINGAPORE |
| Pub. date: |
14 June, 2019 |
| Edition: |
1st ed. 2019 |
| Description: |
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. |
| Illustrations: |
86 Illustrations, color; 97 Illustrations, black and white; Approx. 350 p. 183 illus., 86 illus. in color. |
| Returns: |
Returnable |
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