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Item Details
Title: ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS (A 4-VOLUME SET)
By: Avram Bar-Cohen
Format: Hardback

List price: £1,311.00
Our price: £1,179.90
Discount:
10% off
You save: £131.10
ISBN 10: 9814327603
ISBN 13: 9789814327602
Availability: Usually dispatched within 1-3 weeks.
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Stock: Currently 0 available
Publisher: WORLD SCIENTIFIC PUBLISHING CO PTE LTD
Pub. date: 1 December, 2014
Pages: 1396
Description: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products. This book provides a treatment of its techniques, configurations, tools and applications.
Synopsis: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, from cell phones to supercomputers, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications. "The Encyclopedia of Thermal Packaging", compiled into four 5-volume sets ("Thermal Packaging Techniques", "Thermal Packaging Configurations", "Thermal Packaging Tools" and "Thermal Packaging Applications"), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging.Each volume in a set comprises 250-350 pages and is written by world experts in thermal management of electronics.
Publication: Singapore
Imprint: World Scientific Publishing Co Pte Ltd
Returns: Returnable
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ADVANCES IN HEAT TRANSFER
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DESIGN AND ANALYSIS OF HEAT SINKS (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET) (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 1: MICROCHANNEL HEAT SINKS FOR ELECTRONICS COOLING (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 2: AIR- AND LIQUID-COOLED COLD PLATES (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 3: DIELECTRIC LIQUID COOLING OF IMMERSED COMPONENTS (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 4: THERMOELECTRIC MICROCOOLERS (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 5: ENERGY EFFICIENT SOLID STATE LIGHTING (HB)
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 6: EXPERIMENTAL THERMOFLUID CHARACTERIZATION OF ELECTRONIC COMPONENTS (HB)

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