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Item Details
Title: HIGH-FREQUENCY CHARACTERIZATION OF ELECTRONIC PACKAGING
By: Luc Martens
Format: Paperback

List price: £126.00


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 1461375738
ISBN 13: 9781461375739
Publisher: SPRINGER-VERLAG NEW YORK INC.
Pub. date: 23 February, 2014
Edition: Softcover reprint of the original 1st ed. 1998
Series: Electronic Packaging and Interconnects 1
Pages: 158
Description: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging.
Synopsis: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Illustrations: XII, 158 p.
Publication: US
Imprint: Springer-Verlag New York Inc.
Returns: Returnable
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