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Item Details
Title:
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HIGH-FREQUENCY CHARACTERIZATION OF ELECTRONIC PACKAGING
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By: |
Luc Martens |
Format: |
Paperback |
List price:
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£126.00 |
We currently do not stock this item, please contact the publisher directly for
further information.
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ISBN 10: |
1461375738 |
ISBN 13: |
9781461375739 |
Publisher: |
SPRINGER-VERLAG NEW YORK INC. |
Pub. date: |
23 February, 2014 |
Edition: |
Softcover reprint of the original 1st ed. 1998 |
Series: |
Electronic Packaging and Interconnects 1 |
Pages: |
158 |
Description: |
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. |
Synopsis: |
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples. |
Illustrations: |
XII, 158 p. |
Publication: |
US |
Imprint: |
Springer-Verlag New York Inc. |
Returns: |
Returnable |
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