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Item Details
Title:
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3D IC STACKING TECHNOLOGY
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By: |
Banqiu Wu, Ajay Kumar, Sesh Ramaswami |
Format: |
Hardback |
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List price:
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£147.99 |
Our price: |
£133.19 |
Discount: |
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You save:
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£14.80 |
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ISBN 10: |
007174195X |
ISBN 13: |
9780071741958 |
Availability: |
Usually dispatched within 1-3 weeks.
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Stock: |
Currently 0 available |
Publisher: |
MCGRAW-HILL EDUCATION - EUROPE |
Pages: |
544 |
Description: |
The latest advances in three-dimensional integrated circuit stacking technology |
Synopsis: |
The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers:High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology |
Illustrations: |
Illustrations |
Publication: |
US |
Imprint: |
McGraw-Hill Professional |
Returns: |
Returnable |
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Encyclopedia of Electronic Components: Sensors for Location, Presence, Proximity, Orientation, Oscillation, Force, Load, Human Input, Liquid and Gas Properties, Light, Heat, Sound, and Electricity (Paperback)
O'Reilly Media, Inc, USA
Our Price :
£17.51
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