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Item Details
Title:
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ADVANCED INTERCONNECTS FOR ULSI TECHNOLOGY
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By: |
Mikhail R. Baklanov (Editor), Paul S. Ho (Editor), Ehrenfried Zschech (Editor) |
Format: |
Hardback |
List price:
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£156.95 |
Our price: |
£141.26 |
Discount: |
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You save:
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£15.69 |
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ISBN 10: |
0470662549 |
ISBN 13: |
9780470662540 |
Availability: |
Usually dispatched within 1-3 weeks.
Delivery
rates
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Stock: |
Currently 0 available |
Publisher: |
JOHN WILEY AND SONS LTD |
Pub. date: |
2 March, 2012 |
Pages: |
606 |
Description: |
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. |
Synopsis: |
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements.It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: * Interconnect functions, characterisations, electrical properties and wiring requirements * Low-k materials: fundamentals, advances and mechanical properties * Conductive layers and barriers * Integration and reliability including mechanical reliability, electromigration and electrical breakdown * New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |
Illustrations: |
Illustrations |
Publication: |
US |
Imprint: |
Wiley-Blackwell |
Returns: |
Returnable |
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Ramadan and Eid al-Fitr
A celebratory, inclusive and educational exploration of Ramadan and Eid al-Fitr for both children that celebrate and children who want to understand and appreciate their peers who do.
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