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Item Details
| Title:
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ADVANCED INTERCONNECTS FOR ULSI TECHNOLOGY
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| By: |
Mikhail R. Baklanov (Editor), Paul S. Ho (Editor), Ehrenfried Zschech (Editor) |
| Format: |
Other digital |
| List price:
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£156.00 |
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We currently do not stock this item, please contact the publisher directly for
further information.
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| ISBN 10: |
1119963672 |
| ISBN 13: |
9781119963677 |
| Publisher: |
JOHN WILEY & SONS INC |
| Pub. date: |
17 February, 2012 |
| Pages: |
624 |
| Description: |
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. |
| Synopsis: |
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements.It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: * Interconnect functions, characterisations, electrical properties and wiring requirements * Low-k materials: fundamentals, advances and mechanical properties * Conductive layers and barriers * Integration and reliability including mechanical reliability, electromigration and electrical breakdown * New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |
| Publication: |
US |
| Imprint: |
John Wiley & Sons Inc |
| Returns: |
Non-returnable |
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