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Item Details
Title: LED PACKAGING FOR LIGHTING APPLICATIONS
DESIGN, MANUFACTURING, AND TESTING
By: Sheng Liu, Xiaobing Luo
Format: Hardback

List price: £109.95
Our price: £98.96
Discount:
10% off
You save: £10.99
ISBN 10: 0470827831
ISBN 13: 9780470827833
Availability: Usually dispatched within 1-3 weeks.
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Stock: Currently 0 available
Publisher: JOHN WILEY AND SONS LTD
Pub. date: 5 July, 2011
Pages: 376
Description: Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials.
Synopsis: Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.* One of the only books to cover LEDs from package design to manufacturing to testing * Focuses on the design of LED packaging and its applications such as road lights * Includes design methods and experiences necessary for LED engineers, especially optical and thermal design * Introduces novel LED packaging structures and manufacturing processes, such as ASLP * Covers reliability considerations, the most challenging problem for the LED industry * Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures * Codes and demonstrations available from the book s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led
Illustrations: Illustrations
Publication: US
Imprint: Wiley-Blackwell
Returns: Returnable
Some other items by this author:
BEING ALIVE AND FINDING SHANGRI-LAS (HB)
COMPUTATIONAL AND STATISTICAL METHODS FOR ANALYSING BIG DATA WITH APPLICATIONS (HB)
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS (HB)
III-NITRIDE LEDS
III-NITRIDE LEDS (HB)
LED PACKAGING FOR LIGHTING APPLICATIONS
LED PACKAGING FOR LIGHTING APPLICATIONS
LED PACKAGING FOR LIGHTING APPLICATIONS
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY (HB)
THERMAL MANAGEMENT FOR OPTO-ELECTRONICS PACKAGING AND APPLICATIONS (HB)
THIS IS NOT AVAILABLE 027955
THIS IS NOT AVAILABLE 046348

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