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Item Details
Title: MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MANUFACTURING, RELIABILITY AND TESTING
By: Sheng Liu, Yong Liu
Format: Electronic book text

List price: £126.00


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 1118082826
ISBN 13: 9781118082829
Publisher: JOHN WILEY & SONS INC
Pub. date: 24 August, 2011
Pages: 288
Publication: US
Imprint: John Wiley & Sons Inc
Returns: Non-returnable
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ANCIENT TEA-HORSE ROAD - CHINESE RED (PB)
BEING ALIVE AND FINDING SHANGRI-LAS (HB)
CHINESE WINE (PB)
COMPUTATIONAL AND STATISTICAL METHODS FOR ANALYSING BIG DATA WITH APPLICATIONS (HB)
COMPUTATIONAL INTELLIGENCE AND INTELLIGENT SYSTEMS (PB)
COMPUTATIONAL INTELLIGENCE AND INTELLIGENT SYSTEMS (PB)
EASY WAY TO THE CORRECT CHINESE PRONUNCIATION (PB)
EVOLVABLE SYSTEMS - FROM BIOLOGY TO HARDWARE (PB)
EVOLVABLE SYSTEMS - FROM BIOLOGY TO HARDWARE (PB)
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS
FREEFORM OPTICS FOR LED PACKAGES AND APPLICATIONS (HB)
III-NITRIDE LEDS
III-NITRIDE LEDS (HB)
LED PACKAGING FOR LIGHTING APPLICATIONS
LED PACKAGING FOR LIGHTING APPLICATIONS
LED PACKAGING FOR LIGHTING APPLICATIONS
LED PACKAGING FOR LIGHTING APPLICATIONS (HB)
MELT ELECTROSPINNING
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY
MODELING AND SIMULATION FOR MICROELECTRONIC PACKAGING ASSEMBLY (HB)
OXIDE THERMOELECTRIC MATERIALS (HB)
PASSIVE AND ACTIVE MEASUREMENT (PB)
POWER ELECTRONIC PACKAGING (HB)
POWER ELECTRONIC PACKAGING (PB)
PRACTICAL DEEP LEARNING AT SCALE WITH MLFLOW
QUALITY OF SERVICE IN OPTICAL BURST SWITCHED NETWORKS (HB)
QUALITY OF SERVICE IN OPTICAL BURST SWITCHED NETWORKS (PB)
STOCHASTIC NETWORK CALCULUS (HB)
STOCHASTIC NETWORK CALCULUS (PB)
THIS IS NOT AVAILABLE 010534
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VALUE IN BUSINESS
VALUE IN BUSINESS (HB)
WAFER-LEVEL CHIP-SCALE PACKAGING (HB)
WAFER-LEVEL CHIP-SCALE PACKAGING (PB)

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