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Item Details
Title: ADVANCED FLIP CHIP PACKAGING
By: Ho-Ming Tong (Editor), Yi-Shao Lai (Editor), C. P. Wong (Editor)
Format: Hardback

List price: £179.99


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 1441957677
ISBN 13: 9781441957672
Publisher: SPRINGER-VERLAG NEW YORK INC.
Pub. date: 1 April, 2010
Edition: 2012
Pages: 560
Description: Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in substrate technology, material development and assembly processes.
Synopsis: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Illustrations: 37 Tables, black and white; VII, 560 p. 413 illus., 242 illus. in color.
Publication: US
Imprint: Springer-Verlag New York Inc.
Returns: Non-returnable
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