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Item Details
Title: ELECTRICAL CONDUCTIVE ADHESIVES WITH NANOTECHNOLOGIES
By: C. P. Wong, Yi Li, Daniel Lu
Format: Paperback

List price: £99.99


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 1489983074
ISBN 13: 9781489983077
Publisher: SPRINGER-VERLAG NEW YORK INC.
Pub. date: 5 September, 2014
Edition: 2010 ed.
Pages: 449
Description: Beginning with an overview of electronic packaging, this insightful book discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).
Synopsis: "Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Illustrations: biography
Publication: US
Imprint: Springer-Verlag New York Inc.
Returns: Returnable
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