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Item Details
Title: MICROENGINEERING OF METALS AND CERAMICS
Volume: v. 4, Pt. 2
By: Henry Baltes (Editor), Oliver Brand (Editor), Gary K. Fedder (Editor)
Format: Hardback

List price: £195.00


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 3527314938
ISBN 13: 9783527314935
Publisher: WILEY-VCH VERLAG GMBH
Pub. date: 12 August, 2005
Series: Advanced Micro and Nanosystems
Pages: 306
Description: Written by the authors from three major competence centers for microengineering, this work covers various aspects of specialized replication techniques and how to use the technologies for testing and characterizing microscale components, while illustrating QA aspects and strategies for automation.
Synopsis: Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Continuing from the previous volume, authors from three major competence centres for microengineering here cover all aspects of specialized replication techniques and how to employ state-of-the-art technologies for testing and characterizing micro-scale components, and illustrate quality control aspects and strategies for automation of production procedures in view of future industrial production and commercialisation.
Illustrations: Illustrations
Publication: Germany
Imprint: Wiley-VCH Verlag GmbH
Returns: Returnable
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CARBON NANOTUBE DEVICES
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CMOS CANTILEVER SENSOR SYSTEMS (HB)
CMOS-MEMS
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CMOS-MEMS (PB)
DAS INTERNATIONALE ZINSRECHT ENGLANDS
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES
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ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES (PB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (HB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (PB)
INKJET-BASED MICROMANUFACTURING (HB)
INKJET-BASED MICROMANUFACTURING, VOLUME 9
MICRO AND NANOMANIPULATION TOOLS (HB)
MICRO PROCESS ENGINEERING
MICRO PROCESS ENGINEERING (HB)
MICRO PROCESS ENGINEERING FUNDAMENTALS, DEVICES, FABRICATION, AND APPLICATIONS (PB)
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (PB)
MICROTRANSDUCER CAD (HB)
MICROTRANSDUCER CAD (PB)
RELIABILITY OF MEMS
RELIABILITY OF MEMS (HB)
RELIABILITY OF MEMS (PB)
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS (HB)
SENSORS, UPDATE 2
SENSORS, UPDATE 4
SENSORS, UPDATE 8
SYSTEM-LEVEL MODELING OF MEMS
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION (HB)


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