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Item Details
Title: ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES
By: Henry Baltes (Editor), Oliver Brand (Editor), Gary K. Fedder (Editor)
Format: Paperback

List price: £75.00


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 352733498X
ISBN 13: 9783527334988
Publisher: WILEY-VCH VERLAG GMBH
Pub. date: 17 April, 2013
Pages: 439
Description: This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon processing.
Synopsis: This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon processing. An insider's view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro- and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass data storage and electrochemical imaging by means of scanning micro- and nanoprobes. The second section on nanodevices first tackles the emerging topic of nanofluidics with a contribution each on simulation tools and on devices and uses, followed by another two on nanosensors featuring CNT sensors and CMOS-based DNA sensor arrays, respectively.
Publication: Germany
Imprint: Wiley-VCH Verlag GmbH
Returns: Returnable
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CARBON NANOTUBE DEVICES
CARBON NANOTUBE DEVICES (HB)
CMOS CANTILEVER SENSOR SYSTEMS (HB)
CMOS-MEMS
CMOS-MEMS (HB)
CMOS-MEMS (PB)
DAS INTERNATIONALE ZINSRECHT ENGLANDS
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES (HB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (HB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (PB)
INKJET-BASED MICROMANUFACTURING (HB)
INKJET-BASED MICROMANUFACTURING, VOLUME 9
MICRO AND NANOMANIPULATION TOOLS (HB)
MICRO PROCESS ENGINEERING
MICRO PROCESS ENGINEERING (HB)
MICRO PROCESS ENGINEERING FUNDAMENTALS, DEVICES, FABRICATION, AND APPLICATIONS (PB)
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (PB)
MICROTRANSDUCER CAD (HB)
MICROTRANSDUCER CAD (PB)
RELIABILITY OF MEMS
RELIABILITY OF MEMS (HB)
RELIABILITY OF MEMS (PB)
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS (HB)
SENSORS, UPDATE 2
SENSORS, UPDATE 4
SENSORS, UPDATE 8
SYSTEM-LEVEL MODELING OF MEMS
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION (HB)

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