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Item Details
Title: MICRO PROCESS ENGINEERING FUNDAMENTALS, DEVICES, FABRICATION, AND APPLICATIONS
By: Norbert Kockmann (Editor), Oliver Brand (Editor), Gary K. Fedder (Editor)
Format: Paperback

List price: £82.95


We currently do not stock this item, please contact the publisher directly for further information.

ISBN 10: 3527335005
ISBN 13: 9783527335008
Publisher: WILEY-VCH VERLAG GMBH
Pub. date: 17 April, 2013
Pages: 529
Description: Now available in softcover, this practical book offers topical content from AMN, the only book series on microsystems technology, on everything from design, simulation, fabrication, to characterization, industrial application and operational issues. .
Synopsis: This edition of 'Micro Process Engineering' was originally published in the successful series 'Advanced Micro & Nanosystems'. Authors from leading industrial players and research institutions present a concise and didactical introduction to Micro Process Engineering, the combination of microtechnology and process engineering into a most promising and powerful tool for revolutionizing chemical processes and industrial mass production of bulk materials, fine chemicals, pharmaceuticals and many other products. The book takes the readers from the fundamentals of engineering methods, transport processes, and fluid dynamics to device conception, simulation and modelling, control interfaces and issues of modularity and compatibility. Fabrication strategies and techniques are examined next, focused on the fabrication of suitable microcomponents from various materials such as metals, polymers, silicon, ceramics and glass. The book concludes with actual applications and operational aspects of micro process systems, giving broad coverage to industrial efforts in America, Europe and Asia as well as laboratory equipment and education.
Publication: Germany
Imprint: Wiley-VCH Verlag GmbH
Returns: Returnable
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CARBON NANOTUBE DEVICES
CARBON NANOTUBE DEVICES (HB)
CMOS CANTILEVER SENSOR SYSTEMS (HB)
CMOS-MEMS
CMOS-MEMS (HB)
CMOS-MEMS (PB)
DAS INTERNATIONALE ZINSRECHT ENGLANDS
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES (HB)
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES (PB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (HB)
FORCE SENSORS FOR MICROELECTRONIC PACKAGING APPLICATIONS (PB)
INKJET-BASED MICROMANUFACTURING (HB)
INKJET-BASED MICROMANUFACTURING, VOLUME 9
MICRO AND NANOMANIPULATION TOOLS (HB)
MICRO PROCESS ENGINEERING
MICRO PROCESS ENGINEERING (HB)
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROENGINEERING OF METALS AND CERAMICS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (PB)
NOVEL PROCESS WINDOWS
NOVEL PROCESS WINDOWS
NOVEL PROCESS WINDOWS
NOVEL PROCESS WINDOWS (HB)
RELIABILITY OF MEMS
RELIABILITY OF MEMS (HB)
RELIABILITY OF MEMS (PB)
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS (HB)
SYSTEM-LEVEL MODELING OF MEMS
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION
THERMOELECTRIC ENERGY CONVERSION (HB)
TRANSPORT PHENOMENA IN MICRO PROCESS ENGINEERING (HB)
TRANSPORT PHENOMENA IN MICRO PROCESS ENGINEERING (PB)

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