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Item Details
Title: MICROENGINEERING OF METALS AND CERAMICS
PART I: DESIGN, TOOLING, AND INJECTION MOLDING
By: Henry Baltes (Editor)
Format: Electronic book text

List price: £186.00


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ISBN 10: 3527616942
ISBN 13: 9783527616947
Publisher: JOHN WILEY AND SONS LTD
Pub. date: 26 September, 2008
Series: Advanced Micro and Nanosystems 30
Pages: 392
Description: Written by the authors from three major competence centers for microengineering, this work covers various aspects of specialized replication techniques and how to use the technologies for testing and characterizing microscale components, while illustrating QA aspects and strategies for automation.
Synopsis: Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of metallic and ceramic materials to replicating micro-scale components by injection molding.
Publication: UK
Imprint: Wiley-VCH Verlag GmbH
Returns: Non-returnable
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DAS INTERNATIONALE ZINSRECHT ENGLANDS
ENABLING TECHNOLOGIES FOR MEMS AND NANODEVICES
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INKJET-BASED MICROMANUFACTURING (HB)
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MICRO AND NANOMANIPULATION TOOLS (HB)
MICRO PROCESS ENGINEERING
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MICRO- AND NANOMANIPULATION TOOLS
MICRO- AND NANOMANIPULATION TOOLS
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MICROENGINEERING OF METALS AND CERAMICS
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MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (HB)
MICROMACHINED ULTRASOUND-BASED PROXIMITY SENSORS (PB)
MICROTRANSDUCER CAD (HB)
MICROTRANSDUCER CAD (PB)
RELIABILITY OF MEMS
RELIABILITY OF MEMS (HB)
RELIABILITY OF MEMS (PB)
RESONANT MEMS
RESONANT MEMS
RESONANT MEMS
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SENSORS, UPDATE 2
SENSORS, UPDATE 4
SENSORS, UPDATE 8
SYSTEM-LEVEL MODELING OF MEMS
THERMOELECTRIC ENERGY CONVERSION
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