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Item Details
Title: PLACEMENT AND ROUTING OF ELECTRONIC MODULES
By: Michael Pecht (Editor)
Format: Hardback

List price: £260.00
Our price: £234.00
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10% off
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ISBN 10: 0824789164
ISBN 13: 9780824789169
Availability: Usually dispatched within 1-3 weeks.
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Publisher: TAYLOR & FRANCIS INC
Pub. date: 12 March, 1993
Series: Electrical and Computer Engineering v. 82
Pages: 352
Description: Presents and compares the fundamental theories and techniques of placement and routing and provides approaches to solving specific problems. Focusing on reliable methods for good manufacturing capability, this work discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories.
Synopsis: This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more.Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.
Illustrations: 1, black & white illustrations
Publication: US
Imprint: Marcel Dekker Inc
Returns: Returnable
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ADVANCED ROUTING OF ELECTRONIC MODULES (HB)
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CONTAMINATION OF ELECTRONIC ASSEMBLIES (HB)
ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
ELECTRONIC PACKAGING RELIABILITY (PB)
ELECTRONICS INDUSTRY IN TAIWAN (HB)
ELECTRONICS INDUSTRY IN TAIWAN (PB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (HB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (PB)
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY (HB)
HANDBOOK OF ELECTRONIC PACKAGE DESIGN (HB)
IC COMPONENT SOCKETS (HB)
INFLUENCE OF TEMPERATURE ON MICROELECTRONICS AND SYSTEM RELIABILITY (HB)
INTEGRATED CIRCUIT, HYBRID AND MULTICHIP MODULE PACKAGE DESIGN (HB)
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES
KOREAN ELECTRONICS INDUSTRY (HB)
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK, SECOND EDITION
QUALITY CONFORMANCE AND QUALIFICATION OF MICROELECTRONIC PACKAGES AND INTERCONNECTS (PB)
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING (HB)
RELIABILITY MONITORING USING SENSOR TECHNOLOGIES
RELIABILITY OF POWER ELECTRONIC CONVERTER SYSTEMS
SOLDERING PROCESSES AND EQUIPMENT (HB)
THE CHINESE ELECTRONICS INDUSTRY (HB)
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THE JAPANESE ELECTRONICS INDUSTRY (PB)
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