pickabook books with huge discounts for everyone
pickabook books with huge discounts for everyone
Visit our new collection website www.collectionsforschool.co.uk
     
Email: Subscribe to news & offers:
Need assistance? Log In/Register


Item Details
Title: GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
By: Michael Pecht, Riko Radojcic, Gopal Rao
Format: Hardback

List price: £150.00
Our price: £135.00
Discount:
10% off
You save: £15.00
ISBN 10: 0849396247
ISBN 13: 9780849396243
Availability: Usually dispatched within 1-3 weeks.
 Delivery rates
Stock: Currently 0 available
Publisher: TAYLOR & FRANCIS INC
Pub. date: 29 December, 1998
Series: Electronic Packaging 5
Pages: 224
Description: Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
Synopsis: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: * failure sites, operational loads, and failure mechanism * intrinsic device sensitivities * electromigration * hot carrier aging * time dependent dielectric breakdown * mechanical stress induced migration * alpha particle sensitivity * electrostatic discharge (ESD) and electrical overstress * latch-up * qualification * screening * guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage.It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Illustrations: 27 black & white tables, 14 black & white halftones
Publication: US
Imprint: CRC Press Inc
Returns: Returnable
Some other items by this author:
ADVANCED ROUTING OF ELECTRONIC MODULES (HB)
CHINA'S ELECTRONICS INDUSTRY (PB)
CONTAMINATION OF ELECTRONIC ASSEMBLIES (HB)
ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
ELECTRONIC PACKAGING RELIABILITY (PB)
ELECTRONICS INDUSTRY IN TAIWAN (HB)
ELECTRONICS INDUSTRY IN TAIWAN (PB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (HB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (PB)
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
HANDBOOK OF ELECTRONIC PACKAGE DESIGN (HB)
IC COMPONENT SOCKETS (HB)
INFLUENCE OF TEMPERATURE ON MICROELECTRONICS AND SYSTEM RELIABILITY (HB)
INTEGRATED CIRCUIT, HYBRID AND MULTICHIP MODULE PACKAGE DESIGN (HB)
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES
KOREAN ELECTRONICS INDUSTRY (HB)
MANAGING MORE-THAN-MOORE INTEGRATION TECHNOLOGY DEVELOPMENT (HB)
MORE-THAN-MOORE 2.5D AND 3D SIP INTEGRAT (PB)
MORE-THAN-MOORE 2.5D AND 3D SIP INTEGRATION (HB)
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT (HB)
PLACEMENT AND ROUTING OF ELECTRONIC MODULES (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK, SECOND EDITION
QUALITY CONFORMANCE AND QUALIFICATION OF MICROELECTRONIC PACKAGES AND INTERCONNECTS (PB)
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING (HB)
RELIABILITY MONITORING USING SENSOR TECHNOLOGIES
RELIABILITY OF POWER ELECTRONIC CONVERTER SYSTEMS
SOLDERING PROCESSES AND EQUIPMENT (HB)
STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS (PB)
THE CHINESE ELECTRONICS INDUSTRY (HB)
THE CHINESE ELECTRONICS INDUSTRY (PB)
THE JAPANESE ELECTRONICS INDUSTRY (PB)
THE KOREAN ELECTRONICS INDUSTRY (PB)
THREE DIMENSIONAL SYSTEM INTEGRATION (HB)
THREE DIMENSIONAL SYSTEM INTEGRATION (PB)

TOP SELLERS IN THIS CATEGORY
Digital Fundamentals (Paperback)
Pearson Education Limited
Our Price : £78.62
more details
Introduction to Electrical Installation Work (Paperback)
Taylor & Francis Ltd
Our Price : £43.19
more details
Vehicle Electronic Systems and Fault Diagnosis (Paperback)
Taylor & Francis Ltd
Our Price : £40.49
more details
Electronics Explained (Paperback)
Elsevier Science & Technology
Our Price : £32.36
more details
Op Amps for Everyone (Paperback)
Elsevier Science & Technology
Our Price : £53.06
more details
BROWSE FOR BOOKS IN RELATED CATEGORIES
 TECHNOLOGY, ENGINEERING, AGRICULTURE, VETERINARY SCIENCE
 electronics & communications engineering
 electronics engineering
 electronic devices & materials


Information provided by www.pickabook.co.uk
SHOPPING BASKET
  
Your basket is empty
  Total Items: 0
 






Early Learning
Little Worried Caterpillar (PB) Little Green knows she''s about to make a big change - transformingfrom a caterpillar into a beautiful butterfly. Everyone is VERYexcited! But Little Green is VERY worried. What if being a butterflyisn''t as brilliant as everyone says?Join Little Green as she finds her own path ... with just a littlehelp from her friends.
add to basket

Early Learning
add to basket

Picture Book
All the Things We Carry PB What can you carry?A pebble? A teddy? A bright red balloon? A painting you''ve made?A hope or a dream?This gorgeous, reassuring picture book celebrates all the preciousthings we can carry, from toys and treasures to love and hope. With comforting rhymes and fabulous illustrations, this is a warmhug of a picture book.
add to basket