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Item Details
Title: ADVANCED ROUTING OF ELECTRONIC MODULES
By: Michael Pecht, Yeun Tsun Wong
Format: Hardback

List price: £165.00
Our price: £148.50
Discount:
10% off
You save: £16.50
ISBN 10: 0849396220
ISBN 13: 9780849396229
Availability: Usually dispatched within 1-3 weeks.
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Stock: Currently 0 available
Publisher: TAYLOR & FRANCIS INC
Pub. date: 23 October, 1995
Series: Electronic Packaging 2
Pages: 480
Description: Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
Synopsis: The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration.Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.
Illustrations: 13 black & white tables
Publication: US
Imprint: CRC Press Inc
Returns: Returnable
Some other items by this author:
CHINA'S ELECTRONICS INDUSTRY (PB)
CONTAMINATION OF ELECTRONIC ASSEMBLIES (HB)
ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
ELECTRONIC PACKAGING RELIABILITY (PB)
ELECTRONICS INDUSTRY IN TAIWAN (HB)
ELECTRONICS INDUSTRY IN TAIWAN (PB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (HB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (PB)
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY (HB)
HANDBOOK OF ELECTRONIC PACKAGE DESIGN (HB)
IC COMPONENT SOCKETS (HB)
INFLUENCE OF TEMPERATURE ON MICROELECTRONICS AND SYSTEM RELIABILITY (HB)
INTEGRATED CIRCUIT, HYBRID AND MULTICHIP MODULE PACKAGE DESIGN (HB)
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES
KOREAN ELECTRONICS INDUSTRY (HB)
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT (HB)
PLACEMENT AND ROUTING OF ELECTRONIC MODULES (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK, SECOND EDITION
QUALITY CONFORMANCE AND QUALIFICATION OF MICROELECTRONIC PACKAGES AND INTERCONNECTS (PB)
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING (HB)
RELIABILITY MONITORING USING SENSOR TECHNOLOGIES
RELIABILITY OF POWER ELECTRONIC CONVERTER SYSTEMS
SOLDERING PROCESSES AND EQUIPMENT (HB)
THE CHINESE ELECTRONICS INDUSTRY (HB)
THE CHINESE ELECTRONICS INDUSTRY (PB)
THE JAPANESE ELECTRONICS INDUSTRY (PB)
THE KOREAN ELECTRONICS INDUSTRY (PB)

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