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Item Details
Title: ELECTRONICS INDUSTRY IN TAIWAN
By: Chung-Shing Lee
Format: Hardback

List price: £165.00
Our price: £148.50
Discount:
10% off
You save: £16.50
ISBN 10: 1138434639
ISBN 13: 9781138434639
Availability: Usually dispatched within 1-3 weeks.
 Delivery rates
Stock: Currently 0 available
Publisher: TAYLOR & FRANCIS LTD
Pub. date: 18 December, 2020
Pages: 170
Returns: Returnable
Some other items by this author:
ADVANCED ROUTING OF ELECTRONIC MODULES (HB)
CHINA'S ELECTRONICS INDUSTRY (PB)
CONTAMINATION OF ELECTRONIC ASSEMBLIES (HB)
ELECTRONIC PACKAGING MATERIALS AND THEIR PROPERTIES
ELECTRONIC PACKAGING RELIABILITY (PB)
ELECTRONICS INDUSTRY IN TAIWAN (PB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (HB)
ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS (PB)
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY
GUIDEBOOK FOR MANAGING SILICON CHIP RELIABILITY (HB)
HANDBOOK OF ELECTRONIC PACKAGE DESIGN (HB)
IC COMPONENT SOCKETS (HB)
INFLUENCE OF TEMPERATURE ON MICROELECTRONICS AND SYSTEM RELIABILITY (HB)
INTEGRATED CIRCUIT, HYBRID AND MULTICHIP MODULE PACKAGE DESIGN (HB)
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES
KOREAN ELECTRONICS INDUSTRY (HB)
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT
PARTS SELECTION AND MANAGEMENT (HB)
PLACEMENT AND ROUTING OF ELECTRONIC MODULES (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK (HB)
PRODUCT RELIABILITY, MAINTAINABILITY, AND SUPPORTABILITY HANDBOOK, SECOND EDITION
QUALITY CONFORMANCE AND QUALIFICATION OF MICROELECTRONIC PACKAGES AND INTERCONNECTS (PB)
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING
RELIABILITY ENGINEERING (HB)
RELIABILITY MONITORING USING SENSOR TECHNOLOGIES
RELIABILITY OF POWER ELECTRONIC CONVERTER SYSTEMS
SOLDERING PROCESSES AND EQUIPMENT (HB)
THE CHINESE ELECTRONICS INDUSTRY (HB)
THE CHINESE ELECTRONICS INDUSTRY (PB)
THE JAPANESE ELECTRONICS INDUSTRY (PB)
THE KOREAN ELECTRONICS INDUSTRY (PB)

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