| Title:
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TESTING OF INTERPOSER-BASED 2.5D INTEGRATED CIRCUITS
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| By: |
Ran Wang, Krishnendu Chakrabarty |
| Format: |
Hardback |
| List price:
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£99.99 |
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| ISBN 10: |
3319547135 |
| ISBN 13: |
9783319547138 |
| Publisher: |
SPRINGER INTERNATIONAL PUBLISHING AG |
| Pub. date: |
29 March, 2017 |
| Edition: |
1st ed. 2018 |
| Pages: |
182 |
| Synopsis: |
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. |
| Illustrations: |
16 black & white illustrations, 102 colour illustrations, 50 colour tables, |
| Publication: |
Switzerland |
| Imprint: |
Springer International Publishing AG |
| Returns: |
Returnable |